Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Selection of Wave Soldering Fluxes for Lead Free Assembly

The process challenges of lead-free wave soldering often requires the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases, the fluxes used in tin-lead soldering work well in lead-free assembly ...

MacDermid Alpha Electronics Solutions

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura