Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Solder Paste Inspection Technologies - 2D-3D Correlation

It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology Manufacturing Processes. In addition, transition to lead free solder paste and use of miniature components, has increased the complexity of the printing process. Read more ...

Speedline Technologies, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura