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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Mechanism & Remedy for Ball-In-Socket & Foot-In-Mud Defects
A common source of defects on area array components is the "ball-in-socket" (or "pillowhead") defect. This defect is defined as one or more connections that show physical contact but no wetting or intermetallic connection after reflow ...
Kester
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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