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Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
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Industry Paper

Mechanism & Remedy for Ball-In-Socket & Foot-In-Mud Defects

A common source of defects on area array components is the "ball-in-socket" (or "pillowhead") defect. This defect is defined as one or more connections that show physical contact but no wetting or intermetallic connection after reflow ...
Kester
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Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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