Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

A Feasibility Study of 01005 Chip Components

A study was performed to understand the assembly constraints of the newest miniaturized package chip components, 01005 (or 0402 metric). The study included all facets of surface mount assembly: pad design and ...

MacDermid Alpha Electronics Solutions

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura