Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Flux Collection & Self Clean Techniques in Reflow Apps

The flux management system for a reflow oven is highly critical to the quality, cost, and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent maintenance, it can also result in poor quality, low throughput, and safety issues. Read more ...

Speedline Technologies, Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura