Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

BGA/CSP Re-balling

The trend in the electronics interconnect industry towards "Area Array Packages" type packages and away from high pin count leaded packages has increased dramatically over the last several years. The primary reasons are included in this white paper.

Circuit Technology Training, Inc. (CTTI)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura