Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

UHDI Fabrication for IC Substrates: SAP and mSAP Processes

Approach described includes adhesion promotion, direct plating, electroless copper, blind-via filling, trench filling, and solder-resist metallization technologies. Precise control of surface preparation, activation, and copper thickness uniformity improves via coverage and interconnection without excessive roughening.

Uyemura International Corporation

Complete the form below to download this technical paper.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura