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High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
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Industry Paper

Investigation & Results on the Phenomenon of "Flying" SMD Components

This paper deals with the fundamentals of heat transfer and the test procedures show how the SOD323 can be processed given a suitable selection of solder paste and oven settings.
Rehm Thermal Systems GmbH
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Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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