Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

The Essential Guide for High-Reliability BGA Component Re-balling

This paper provides a comprehensive overview of the challenges and best practices associated with the reballing process of Ball Grid Array (BGA) components. The paper explores the complexities involved in removing and replacing solder balls on BGAs, emphasizing the criticality of achieving high-reliability connections. The guide covers various topics, including selecting appropriate reballing techniques, the importance of accurate alignment, solder ball composition considerations, and the significance of proper thermal profiling.

Circuit Technology Center Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura