| Industry Paper |
Impact of high peak reflow temperature on flux removal of high Pb solder paste
Voiding in high lead (Pb) solder joint is an on-going problem especially for power electronics. This paper evaluated cleaning effectiveness of discrete packages soldered with various high lead solder pastes.
ZESTRON Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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