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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Impact of high peak reflow temperature on flux removal of high Pb solder paste
Voiding in high lead (Pb) solder joint is an on-going problem especially for power electronics. This paper evaluated cleaning effectiveness of discrete packages soldered with various high lead solder pastes.
ZESTRON Corporation
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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