Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

The Essential Guide to Large-Volume Thermal Interface Materials (TIM) Dispensing

Dispensable TIMs help to lower overall thermal resistance in applications for automotive, 5G, consumer electronics and more. If you're choosing a dispensable TIM for your application, download this guide.

Nordson Electronics Solution (previously Nordson ASYMTEK)

Complete the form below to download this technical paper.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura