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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Inductive Soldering for High Thermal Demand Applications
Inductive vs. Resistive Heating Technology Used in Soldering Systems - A performance comparison based on Time to Temp, Dwell Time, & Thermal Recovery to identify best soldering product for the production line.
OK International
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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