| Industry Paper |
The Elimination of Whiskers from Electroplated Tin
In a study, two approaches were explored to prevent whisker growth in tin deposits over copper. First by creating a uniform IMC by micro-roughening the copper substrate prior to tin deposition. The second modified the grain, from a large columnar structure to a fine grained equiaxed structure. Learn more.
Uyemura International Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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