Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

The Elimination of Whiskers from Electroplated Tin

In a study, two approaches were explored to prevent whisker growth in tin deposits over copper. First by creating a uniform IMC by micro-roughening the copper substrate prior to tin deposition. The second modified the grain, from a large columnar structure to a fine grained equiaxed structure. Learn more.

Uyemura International Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura