|
Sponsor
|
|
Circuitnet Advertising Delivers Results!
Introduce your technology, new products or services in our daily e-mail newsletter & website to see how a digital advertising campaign can deliver results. Reach over 200,000 professionals.
Circuitnet LLC
|
|
| Industry Paper |
The Elimination of Whiskers from Electroplated Tin
In a study, two approaches were explored to prevent whisker growth in tin deposits over copper. First by creating a uniform IMC by micro-roughening the copper substrate prior to tin deposition. The second modified the grain, from a large columnar structure to a fine grained equiaxed structure. Learn more.
Uyemura International Corporation
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Optimize Your Process on Full SMT Demo Line
Validate your process in our demo lab. Our full line—printing, P&P, reflow, and AOI—is ready to optimize your profile and prove performance. Send us your boards to start.
Heller Industries
|
|
|