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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

ENEPIG Deposit Enhancement Achieves Ultimate Goal: Thicker, Lower Porosity Gold

RAIG (reduction-assisted immersion gold) for ENEPIG allows deposition of 4-6 µin gold on electroless nickel, electroless palladium. Hybrid, "mixed reaction" bath uses immersion and autocatalytic deposition for zero gold porosity.
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Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp