| Industry Paper |
ENEPIG Deposit Enhancement Achieves Ultimate Goal: Thicker, Lower Porosity Gold
RAIG (reduction-assisted immersion gold) for ENEPIG allows deposition of 4-6 µin gold on electroless nickel, electroless palladium. Hybrid, "mixed reaction" bath uses immersion and autocatalytic deposition for zero gold porosity.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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