Save Without Compromise
Unlike other low-silver alloys, REL61 delivers 10-20% cost savings while improving performance across key metrics - no trade-offs needed. AIM Solder
Technical Paper
Selective Soldering Fine Pitch Components on High Thermal Mass Assembly
Miniaturization in electronics has resulted in less THT (through-hole technology) and leads with a finer pitch. For this reason, the soldering of these components has also changed from wave soldering to Point-to-point selective soldering.
ITW EAE
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Gold Embrittlement Solved!
We use robotic hot solder dip equipment for gold removal on SMT and through-hole components. Gold plating is fully removed and replaced with tin-lead solder. Circuit Technology Center
