Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

True3D™ Innovations Powered by AI

The machine-to-machine (M2M) communications, guided in part by Industry 4.0, are quickly changing the manufacturing process by aggregating process data such as first pass yield and throughput. Equipment providers like Koh Young are enabling the Smart Factory of the Future by adopting AI to generate "knowledge" from "experience."

Koh Young Technology Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura