Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

How well can you 'Pin Down' defects in the press-fit process?

Electronics manufacturers are introducing new safety systems, which need to be highly reliable. Yet, striking a balance between cost and quality is always a challenge. Koh Young has introduced the KY-P3 Automated Pin Inspection solution to help pin down defects.

Koh Young Technology Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura