| Industry Paper |
Eliminating Ni Corrosion in ENIG/ENEPIG Using RAIG
Study documents advantages of Reduction-Assisted Immersion Gold ("RAIG") over conventional immersion gold. RAIG won't corrode underlying nickel, even at low electroless palladium thickness. Also, RAIG deposits up to 8uins gold.
Uyemura International Corporation
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
|
|
|
