Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Eliminating Ni Corrosion in ENIG/ENEPIG Using RAIG

Study documents advantages of Reduction-Assisted Immersion Gold ("RAIG") over conventional immersion gold. RAIG won't corrode underlying nickel, even at low electroless palladium thickness. Also, RAIG deposits up to 8uins gold.

Uyemura International Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura