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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Reliable Nickel-free Surface Finish Solution for High Frequency-HDI PCB Applications
Surface finish on PCBs is among the primary factors affecting the integrity of high frequency signals in high frequency-HDI PCBs. Details will be discussed on an innovative-reliable nickel-less approach which has shown superior benefits for high frequency-HDI PCBs.
LiloTree
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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