|
| Industry Paper |
High-Density Micro-dispensing Solder and Adhesives
With emerging technologies that include flexible hybrid electronics (FHE) and 3D printed electronics, new deposition methods are needed for volumetric control and precision microdispensing of solders and adhesives with geometries under 50 microns.
nScrypt, Inc.
|
|
Complete the form below to download this technical paper.
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
