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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
High-Density Micro-dispensing Solder and Adhesives
With emerging technologies that include flexible hybrid electronics (FHE) and 3D printed electronics, new deposition methods are needed for volumetric control and precision microdispensing of solders and adhesives with geometries under 50 microns.
nScrypt, Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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