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Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
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Industry Paper

Eliminate Voids with Vacuum Reflow

Void elimination is essential for high power / high heat dissipating products. This paper details the fine points of void reduction with Heller Vacuum Reflow ovens, the only systems that can deliver <1% void rate at Production Volumes.
Heller Industries Inc.
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Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
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