| Industry Paper |
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG? EPIG? Electroless palladium immersion gold is a new final finish for enhancing copper circuits solderability without electroless nickel. Paper contrasts ENIG and EPIG solderability, as-plated and following steam aging.
Uyemura International Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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