Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Comparing Soldering Results of ENIG and EPIG Post Steam Exposure

ENIG? EPIG? Electroless palladium immersion gold is a new final finish for enhancing copper circuits solderability without electroless nickel. Paper contrasts ENIG and EPIG solderability, as-plated and following steam aging.

Uyemura International Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura