| Industry Paper |
How solder ball technology can facilitate QFP device transition
Unique application of solder ball technology facilitates QFP to BGA device transition on PC boards with existing QFP pads, while eliminating solder processing issues associated with gull-wing lead frames.
Advanced Interconnections Corp.
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
|
|
|
