Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Characteristics of EPIG Deposits for Fine Line Applications

Fine pattern plating, solder joint reliability & wire bonding reliability of EPIG and ENEPIG deposits were compared. Effects of gold and palladium thicknesses, heat treatment and plasma treatment are summarized.

Uyemura International Corporation

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura