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Industry Paper

Characteristics of EPIG Deposits for Fine Line Applications

Fine pattern plating, solder joint reliability & wire bonding reliability of EPIG and ENEPIG deposits were compared. Effects of gold and palladium thicknesses, heat treatment and plasma treatment are summarized.
Uyemura International Corporation
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Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
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