| Industry Paper |
Characteristics of EPIG Deposits for Fine Line Applications
Fine pattern plating, solder joint reliability & wire bonding reliability of EPIG and ENEPIG deposits were compared. Effects of gold and palladium thicknesses, heat treatment and plasma treatment are summarized.
Uyemura International Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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