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Industry Paper

An Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Assemblies

Conventional Electroless Nickel/Immersion Gold (ENIG) is prone to black-pad defects (hyper-corrosion failures) and brittle solder joint failures which lead to reliability concerns of electronic assemblies. The novel ENIG eliminates black pad defects, achieves robust solder joints and provides improved quality-reliability of electronic assembly.
LiloTree
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BEST Inc.
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Mobile training center offers IPC certified classes at your company’s facility making solder training effective and convenient for your entire team.
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