| Industry Paper |
An Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) is prone to black-pad defects (hyper-corrosion failures) and brittle solder joint failures which lead to reliability concerns of electronic assemblies. The novel ENIG eliminates black pad defects, achieves robust solder joints and provides improved quality-reliability of electronic assembly.
LiloTree
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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