|
Sponsor
|
|
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
|
|
| Industry Paper |
An Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Assemblies
Conventional Electroless Nickel/Immersion Gold (ENIG) is prone to black-pad defects (hyper-corrosion failures) and brittle solder joint failures which lead to reliability concerns of electronic assemblies. The novel ENIG eliminates black pad defects, achieves robust solder joints and provides improved quality-reliability of electronic assembly.
LiloTree
|
Complete the form below to download this technical paper.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
|