Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Where No Machine Has Gone Before: Automated Assembly Verification

For high-precision, highly-detailed, complex, or low-contrast assembly inspection tasks, Radiant's INSPECT.assembly solution is more accurate than human vision, and offers the speed, consistency, and data advantages of automation.

Radiant Vision Systems

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura