| Industry Paper |
Reducing the Cost of Applying Package-Level EMI Shield Coatings
A substantial reduction in process cost (up to 60%) can be achieved by using ultra-Thin Coating Application Technology to apply sprayable high-performance coatings in a less than 10µm conductive metal EMI shielding layer to individual packages.
Ultrasonic Systems, Inc.
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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