| Industry Paper |
Reducing the Cost of Applying Package-Level EMI Shield Coatings
A substantial reduction in process cost (up to 60%) can be achieved by using ultra-Thin Coating Application Technology to apply sprayable high-performance coatings in a less than 10µm conductive metal EMI shielding layer to individual packages.
Ultrasonic Systems, Inc.
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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