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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Why vapor phase soldering?
For contemporary complex BGA, FPGA and the new generation of SMD components, the vapor phase solder method is the only method which is relatively simple. It's easy for the professional, amateur and hobbyist to achieve a PERFECT solder result.
IMDES Creative Solutions
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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