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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Reflow Soldering

Although reflow soldering in not new, surface-mount technology and lead-free soldering have prompted new industry techniques. Learn how to achieve an ideal reflow solder profile with this 4-page paper.
Advanced Assembly
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Sponsor
Advanced Interconnections Corp
Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp