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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Seven Common Component Selection Pitfalls
Component selection and placement are mutually dependent on one another and need to be continuously monitored at all stages of design. With hundreds of factors to account for, it's easy to become overwhelmed. See the most commonly overlooked elements of component PCB design.
Advanced Assembly
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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