Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Optimum 3D Application in Automatic Optical Inspection

The third dimension is an increasingly essential aspect of AOI. Today, the decisive factors in 3D inspection include true-to-life representation from all selectable viewing angles, first-class throughput strengths, exact, certified 3D measurement and multiply networked data exchange.

Viscom Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura