Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Low Temperature Shock Resistance Solder

As handheld devices become increasingly smaller and complex, there is a shift in reliability requirements of solder pastes. Use of low temperature alloys results in a series of benefits for handheld applications, such as lower incidence of defects caused by higher reflow temperature.

MacDermid Alpha Electronics Solutions

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura