Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Vapor phase reflow's effects on surface insulation resistance

Surface insulation resistance (SIR) is a critical property for reliable assemblies using no-clean SMT process. Studies show that the reflow profile and atmosphere used can have significant effects on the SIR properties. In this study, multiple reflow profiles were used in a vapor phase reflow process.

MacDermid Alpha Electronics Solutions

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura