Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Improve High-Volume Conformal Coating

When you pair non-atomized film coaters with jet or needle conformal coating applicators, speed & broad passes are combined with finesse & better access around components. Nordson ASYMTEK whitepaper explains process and study results.

Nordson Electronics Solution (previously Nordson ASYMTEK)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura