Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

High-Performance Resin Chemistries for Electronics Protection

Epoxy, Silicone, Polyurethane? Resin systems are designed to protect and insulate PCBs and electronic components from harsh and challenging environments. This paper examines different resin systems, to help make product selection easier for your application.

Electrolube

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura