| Industry Paper |
High Power Density? No Problem.
High thermal conductivity and low compression stress combine in the latest thermal management innovation from Henkel. Very soft and compliant, yet remarkably durable with 5.0 W/m-K thermal conductivity, GAP PAD HC 5.0 addresses the heat management challenges of modern product designs. Find out more.
Henkel Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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