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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
High Power Density? No Problem.
High thermal conductivity and low compression stress combine in the latest thermal management innovation from Henkel. Very soft and compliant, yet remarkably durable with 5.0 W/m-K thermal conductivity, GAP PAD HC 5.0 addresses the heat management challenges of modern product designs. Find out more.
Henkel Corporation
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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