| Industry Paper |
High Power Density? No Problem.
High thermal conductivity and low compression stress combine in the latest thermal management innovation from Henkel. Very soft and compliant, yet remarkably durable with 5.0 W/m-K thermal conductivity, GAP PAD HC 5.0 addresses the heat management challenges of modern product designs. Find out more.
Henkel Corporation
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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