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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Assemble, Cool, Encapsulate, Illuminate
Consumers want LEDs that offer optimal light and long life. Satisfying the value proposition of LEDs versus incandescent lighting is highly dependent on the reliability of the LED assembly and, therefore, the underlying materials. Find out what a total materials solution can mean for LED performance.
Henkel Corporation
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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