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Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Industry Paper

Raise Conductivity, Reduce Material Use

Henkel's latest electronic ink breakthroughs answer the need for performance and cost-effectiveness. Higher conductivity in finer lines allows the use of less material for the same- or better-performance. And, new force sensing inks are lending functionality expansion for medical, consumer and entertainment applications. Learn more.
Henkel Corporation
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Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH