Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Reflow in Today's High-Mix/High-Volume Production Environment

Today's SMT market is mainly high-mix/low- to medium-volume. Many production lines now experience more downtime than production time because of machine setup and changeover time. The reflow oven can cause much of the downtime but, used correctly, it can significantly improve line changeover, profit and delivery times.

KIC

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura