Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Fluid Dispensing Applications and Methods for LEDs

For LEDs, fluid dispensing applications must take into account CIE value, heat dissipation, LED life, power savings, and production costs. Nordson ASYMTEK's article Dispensing Solutions for the LED Industry details the equipment, processes, and capabilities required. Click to Download.

Nordson Electronics Solution (previously Nordson ASYMTEK)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura