Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Embracing Interactive Electronic Work Instructions

New paperless interactive work instructions incorporate real time documentation and data collection tools, fundamental for Lean, Six Sigma, ISO, FDA and other improvement, regulatory or compliance programs. These scalable multi-language tools Document, Integrate, Deploy, Execute, Track and Analyze manufacturing processes.

ScanCAD International Inc.

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura