Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

What are the benefits of soldering with vacuum profiles?

Requirements for void-free solder joints with reductions or elimination of cavities in the connection technology used between component connectors and pads are expanding. This paper outlines information for soldering with vacuum profiles in a 3-part series.

Rehm Thermal Systems GmbH

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura