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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Best Practices in Documentation
Different phases of the manufacturing process require different files and information, but you can expedite the overall turn-time by having the necessary information prepared prior to approaching the respective vendor. Not only will this make it easier and faster to obtain accurate quotes, but complete and clear documentation will also greatly reduce the chance of misunderstandings and errors. This 2-page white paper discusses how a small investment in time up front will make the whole manufacturing and assembly process smoother and faster.
Advanced Assembly
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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