Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

8 Cost Saving Steps for Your Next Design

Big or small, every company is looking for ways to reduce cost without affecting quality. But, this isn''t so easy, especially when it comes to PCB assembly. Often selecting an assembly partner based just on price ends up costing more in the long term due to reliability issues and lower throughput. This 4-page white paper reveals low to no-cost, easy recommendations that will help you lower the overall price of your assemblies while still working with the best-of-breed assembly shop.

Advanced Assembly

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura