Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Industry Paper

Precise High-throughput Solder Dispensing

Nordson ASYMTEK's high-precision, high-throughput solder paste dispensing application increases throughput, improves accuracy and provides flexibility over traditional stencil printing and low-throughput dispensing. Read the article.

Nordson Electronics Solution (previously Nordson ASYMTEK)

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Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura