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Sponsor
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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Facing the Challenges of THT Inspection
The deployment of AOI technology for THT inspection has historically been restricted by a number of factors. These include the physical configuration of most wave and selective soldering lines, which do not lend themselves to conventionally designed AOI machines now popular in SMT flow lines.
MEK Europe BV
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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