A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped PoP

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. Learn more in this white paper by Indium Corporation Vice President of Technology, Dr. Ning-Cheng Lee. Find out more...