| Industry Paper |
A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped PoP
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. Learn more in this white paper by Indium Corporation Vice President of Technology, Dr. Ning-Cheng Lee. Find out more...
Indium Corporation
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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
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