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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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| Industry Paper |
Advantages of the Contaminometer™ AKA CM Series
Cleanliness or Process Control? Cleanliness assumes you have tested all possible contaminants on the board. You can't do this! Process control assumes you are removing the same contaminants every time. You can do this reliably and reproducibly!
Ascentech LLC - GEN3
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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