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Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
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Industry Paper

No-Clean Paste Flux: Reflow Profiling and Electrical Reliability

About 80% of the world's SMT assembly uses no-clean soldering. The increasing miniaturization that dominates modern electronics devices requires no-clean flux residues to be benign and electrically resistive. Learn more about this from Indium Corporation technology expert, Eric Bastow ...
Indium Corporation
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