| Industry Paper |
BGA Assembly Voiding, Reliability Using SAC, BiSnAg Alloys
This paper reviews data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions. Learn more in this white paper by Indium Corporation Vice President of Technology Dr. Ning-Cheng Lee. Find out more...
Indium Corporation
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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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